Binder system useful e.g. for thermoplastic molding compositions for low-pressure injection molding, and for preparing feedstock for low pressure injection molding, comprises two waxes exhibiting different melting points
Binder system comprises at least two waxes exhibiting different melting points. The binder system exhibits a viscosity of less than 100 mPas. An independent claim is also included for debinding a molding composition containing the above binder system, comprising (a) transferring the molding composition to a solvent, (b) heating the molding composition and the solvent to a temperature range, whose lower limit is the melting temperature of the wax with lowest melting temperature, and upper limit is the melting temperature of the wax with highest melting temperature, (c) transferring the molding composition in a solvent at a temperature mentioned in the step (b), and (d) removing the molding composition.
A binder system for thermoplastic molding compositions for low-pressure injection molding, characterized in that the binder system comprises at least two waxes, that the two waxes have different melting points, and the binder system has a viscosity of less than 100 mPas.